Underfill & encapsulants
Suppliers: Henkel, Wacker Silicones
- Durable protection against vibration and mechanical stress
- Effective component encapsulation
- Extended service life through protection against environmental and operational stressors
Underfill
On PCBs, protection against shock, thermal shock, moisture and other potentially harmful environmental influences can be crucial for long-term reliability. Underfill also improves reliability when painting with acrylic paints.
Henkel offers innovative capillary flow underfill for flip chips, CSPs and BGA devices that reduces stress, improves reliability and delivers outstanding processability. Henkel’s underfill has a high proportion of speciality filler to achieve low CTE.
Henkel Electronics has now developed UF1173, an environmentally friendly underfill delivering high reliability. It does not contain any REACH SVHC*-listed raw materials (June 2018) and is not CMR** classified.
Glob Top & Dam-and-fill
Here you will find materials for potting single components and microelectronics, dam-and-fill and glob top. Henkel’s potting materials and adhesives protect PCBs and electronics by enhancing mechanical strength, providing electrical insulation and protecting against vibrations and shocks.
Specifications
Suppliers
