Interface materials

To achieve the most efficient possible heat dissipation in an application, the heat needs to be removed from the hot component. The challenge when it comes to dissipating heat from electronics lies in eliminating air pockets and voids that exist between the hot component and the cooling profile. 

To make the solution as efficient as possible, the design should incorporate the thinnest possible thermal material. This will provide the best heat transfer, require less performance and be cost-effective. Remember: as thin as possible – as thick as required. The thicker the material required, the longer the cooling pathway will be, thereby also requiring higher thermal conductivity to achieve for the same result.

Together with our sister company ATC Tape Converting, we are able to customise and supply the components in the shape and design you require. ATC has extensive experience of punching and converting materials.