Low pressure moulding

Low pressure moulding is a relatively simple and extremely rapid process for protecting electrical components against moisture, dust, dirt and vibrations, etc.

Henkel’s renowned Technomelt (polyamide) offers significant advantages with its fast processing time under low pressure. This also means that sensitive and fragile components/circuits are not damaged and can withstand the encapsulation process.

This allows for a freer design of the application and means that the process can be adapted for boards with components that have a significant height difference. The reduced material consumption and low material density make the applications lighter than using traditional potting methods, which is very important in many applications.

Advantages of Technomelt

• Short process time under low pressure
• Suitable for fragile and sensitive components
• Natural ingredients
• No harmful fumes from the melting process
• Long shelf life
• RoHS and REACH compliant